Home > Services

Fast Packaging


XZ-Testing also offer fast-turn IC assembly services
1. Ceramic package: DIP8, DIP14,DIP16,DIP24, DIP28, DIP32, DIP64
2. Plastic package: BGA144,BGA256, QFP64,QFP100,QFP128
No minimum order quantities
Fast-turn around – same-day delivery possible (only for ceramic package)
Flexibility to handle non-standard die/wire bond layouts.
Fast-turn IC assembly Application background and  benefits;
  • ---Remolding /Repackage option for FA;
  • ---Match  existing socket、 test board;
  • ---Accurate performance evaluation/validation of simulations and electrical parameters.

Share to Wechat
XML 地图 | Sitemap 地图