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Fast Packaging

 

XZ-Testing also offer fast-turn IC assembly services
1. Ceramic package: DIP8, DIP14,DIP16,DIP24, DIP28, DIP32, DIP64
2. Plastic package: BGA144,BGA256, QFP64,QFP100,QFP128
 
No minimum order quantities
Fast-turn around – same-day delivery possible (only for ceramic package)
Flexibility to handle non-standard die/wire bond layouts.
  •  
Fast-turn IC assembly Application background and  benefits;
  • ---Remolding /Repackage option for FA;
  • ---Match  existing socket、 test board;
  • ---Accurate performance evaluation/validation of simulations and electrical parameters.


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